ACA: Anisotropic Conductive Adhesive
ACF: Anisotropic Conductive Foil
Ag: Silver
Au: Gold
BGA: Ball Grid Array
COF: Chip On Foil
COG: Chip On Glass
CSP: Chip Scale Package
CTE: Coefficient of Thermal Expansion
DFA: Design For Assembly
DFM: Design for Manufacturing
DFR: Design For Reliability
EDC: Embedded Discrete Components
EMC: Electro-Magnetic Compatibility
ENIG: Electro-less Nickel / Immersion gold
ESD: Electro Static Discharge
FPC: Flexible Printed Circuit
FR4: Flame Resistant material with resin type 4 (epoxy)
HAST: Highly Accelerated Stress Test
HATO: Halogen and Antimony Trioxide
HDI: High Density Interconnections
HW: Hardware
IMAPS: International Microelectronics And Packaging Society
IMC: Inter Metallic Compound
IPC: The Institute for Interconnecting and Packaging Electronic Circuits
ISHM: International Society of Hybrid Microelectronics
ITO: Indium Tin Oxide
MCM: Multi Chip Module
Ni: Nickel
Ni/Au: Nickel/Gold
NPTH: Non Plated Through Hole
OSP: Organic Solderability Preservative
PCB: Printed Circuit Board = Printed Wiring Board
PCL: Printed Conductive Layer
PI: Polyimide
PSA: Pressure Sensitive Adhesive
PTF: Polymer ThickFilm
PTH: Plated Through Hole
PWB: Printed Wiring Board = Printed Circuit Board
RCCu: Resin Coated Copper Foil
RoHS: Restriction of Hazardous Substances
SEM: Scanning Electron Microscope
SiP: System in Package
SMD: Surface Mounted Device
SMT: Surface Mount Technology
Sn: Tin
SO2: Sulfur Dioxide
SoC: System on Chip
TC: Temperature Cycling
Tg: Glass Transition temperature
UI: User Interface
UL: Underwriters Laboratories
UTCP: Ultra Thin Chip Package
WLCSP: Wafer Level Chip Scale Package
ZIF: Zero Insertion Force