Abbreviations

ACA:  Anisotropic Conductive Adhesive

ACF:  Anisotropic Conductive Foil

Ag:  Silver

Au:  Gold

BGA:  Ball Grid Array

COF:  Chip On Foil

COG:  Chip On Glass

CSP:  Chip Scale Package

CTE:  Coefficient of Thermal Expansion

DFA:  Design For Assembly

DFM:  Design for Manufacturing

DFR:  Design For Reliability

EDC:  Embedded Discrete Components

EMC:  Electro-Magnetic Compatibility

ENIG:  Electro-less Nickel / Immersion gold

ESD:  Electro Static Discharge

FPC:  Flexible Printed Circuit

FR4:  Flame Resistant material with resin type 4 (epoxy)

HAST:  Highly Accelerated Stress Test

HATO:  Halogen and Antimony Trioxide

HDI:  High Density Interconnections

HW:  Hardware

IMAPS:  International Microelectronics And Packaging Society

IMC:  Inter Metallic Compound

IPC:  The Institute for Interconnecting and Packaging Electronic Circuits

ISHM:  International Society of Hybrid Microelectronics

ITO:  Indium Tin Oxide

MCM:  Multi Chip Module

Ni:  Nickel

Ni/Au:  Nickel/Gold

NPTH:  Non Plated Through Hole

OSP:  Organic Solderability Preservative

PCB:  Printed Circuit Board = Printed Wiring Board

PCL:  Printed Conductive Layer

PI:  Polyimide

PSA:  Pressure Sensitive Adhesive

PTF:  Polymer ThickFilm

PTH:  Plated Through Hole

PWB:  Printed Wiring Board = Printed Circuit Board

RCCu:  Resin Coated Copper Foil

RoHS:  Restriction of Hazardous Substances

SEM:  Scanning Electron Microscope

SiP:  System in Package

SMD:  Surface Mounted Device

SMT:  Surface Mount Technology

Sn:  Tin

SO2:  Sulfur Dioxide

SoC:  System on Chip

TC:  Temperature Cycling

Tg:  Glass Transition temperature

UI:  User Interface

UL:  Underwriters Laboratories

UTCP:  Ultra Thin Chip Package

WLCSP:  Wafer Level Chip Scale Package

ZIF:  Zero Insertion Force