• Frequently Asked Questions:

    Q1: Our company have been soldering on Immersion Gold plated PCB’s for years without problems but now we experience many field failures with BGA/CSP type components. What is the problem?


    A1: There can be many reasons but there is a high probability that the solder-joints are cracking because of high stress from mechanical shock.

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  • Q2: What should we pay special attention to when changing process from Lead based solder to Leadfree solder?


    A2: Many things have to be considered on beforehand but the most important is to:

    - assure that the PCB and components can withstand the higher temperature impact during reflow soldering

    - be aware that even though std 63Sn-37Pb can cause electromigration then the leadfree Sn 4.0Ag -0.5Cu significantly increase the probability and speed for migration so protection against liquid ingress must be thoroughly considered.

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