E-Consult International Services

E-Consult International can give your company a second opinion, sparring and professional advice for optimization of: - Electromechanical Device Concepting, - PCB/substrate Technology selection, - Component Packaging technology selection, - Electromechanical interconnection technology and material selection, - Design For Manufacturing and Reliability.

  • Electronic Device Concepting and Design

    - Miniaturisation, Module design

    - SiP (System In Package), MCM (Multi Chip Module)

    - DFM/DFA (Design For Manufacturing and assembly)

    - Design for ROHS Compliance

    - DFR (Design For Reliability)

    - Design for lowest TOTAL cost

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  • Electronic substrate Technology selection

    - Rigid and Flexible PCB’s

    - Build-up's

    - Surface finish for PCB and FPC

    - Printed Electronics by use of screen printing or Ink-jetting

    - Ceramic and Polymer Thickfilm, Nano-Ink circuitry

  • Component Packaging technology selection:

    - SMD, HMD

    - BGA, CSP, Flip Chip, Chip on Chip, Chip on Glass, Chip & Wire

    - Package Stacking, Die stacking

    - Embedded Actives and Passives

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  • Electromechanical interconnection technology selection:

    - Connector types and contact spec. requirements

    - Spring contacts, Pick and Place Pads

    - ACF/ACP-bonding

  • Review and sparring:

    - Design/reliability review of existing electronics devices

    - Support to reliability milestone review

    - Review and 2nd opinion on your current selection of PCB manufacturer and EMS

    - Technical support to revision/creation of HW-technology roadmaps

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