Technical Papers - Presentations, publications and articles

Claus Würtz Nielsen has given several presentations at Technology Seminars and International Microelectronics Conferences (IMAPS, ICEP, SMTA, ...) in USA, Japan, China, Germany, The Netherlands, Finland, Norway, Sweden and Denmark.

Claus has also contributed to articles in Electronics magazines and technical publications.

June 2017: Asymtek Technology Days, Geldrop, The Netherlands: Title: Coating considerations.

June 2015: Asymtek Technology Days, Maastricht, The Netherlands: Title: Why and When is Coat and Underfill needed?

Apr 2015: HIN Seminar, Horsens, Denmark: Why and when is Coating and Cleaning needed?

Oct 2014: Article in the Danish Electronics News Magazine “Elektronik & Data” October edition: "Coating beskytter elektronikken".

Aug 2014: Article in the Danish Electronics News Magazine “Elektronik & Data” August edition: "Dybt i Nokias maskinrum".

2014: PCB Reliability Seminar, Copenhagen, Denmark: How to improve PCB/PCBA design, performance and reliability.

Mar 2013: SPM Erfagruppe 20 – DFMA – Design For Manufacturing and Assembly meeting hosted by B&O, Struer, Denmark: From DIL-packages to Embedded Components V2.0. The evolution of Component Packaging-, Interconnection- and Substrate-Technologies.

Nov 2012: IPU “Corrosion in Electronics” Seminar, Lyngby, Denmark. Title of presentation: Organisation structure impact on reliability problem solving.

Dec 2011: Printline Seminar at the Danish Embassy in Oslo Norway.Title of presentation 1: From DIL-Packages to Embedded Components. Title of presentation 2: Interconnect reliability problems and solutions.

Nov 2011: Printline Seminar, Odense Denmark. Title of presentation 1: From DIL-Packages to Embedded Components. Title of presentation 2: Interconnect reliability problems and solutions.

Jun 2011: Asymtek Technology Days, Heerlen The Netherlands: Title: Micro Coating and Underfill – a must to obtain high reliability of mobile devices.

Mar 2003: DAMAG Temadag for printdesignere, Odense Denmark: Title: Kultryk på print.

Apr 2006: ICEP Conference, Tokyo Japan: Title: Paradigm shift for PWB surface finishes in mobile phone terminals.

Feb 2006: Pan Pacific Electronic Symposium, Hawaii, Title: New trends for PWB surface finishes in mobile phone applications.

2004: IMAPS Nordic Conference, Helsingør Denmark: Title: The evolution of surface finishes in mobile phone applications.

1993: Articles in the Danish Electronics News Magazine “Elektronik & Data”: June edition: Laser trimming Thickfilm Hybrids. October edition: “Chip & Wire” techniques

1991: Article in the international magazine “Circuit World” Vol.17, Number 3: Design Guidelines for Polymer Thickfilm Technology.

1990: Co-author to: Polymer Thickfilm Technology design guidelines and applications. A result of a Nordic cooperation project (1988-1990) supported by Nordic Fund for Technology and Industrial Development (Nordisk Industrifond). ISBN 82-992193-0-2.

1990: Theme days at “Instituttet for Verkstadsteknisk Forskning” (Sweden), and at Elektronik Centralen (Denmark), Title: Polymer Thick Film Connection Techniques.

1990: ISHM NORDIC Conference at Ålandsøerne (Finland). Title: PTF. An attractive supplement to traditional Thickfilm and PCB technology.

1987: Polymer Circuit and Component Board (PC2B). EC-report ECR-202.

1986: ISHM NORDIC Conference in Helsinki, Finland. Title: Results from the PTF Research Project “PC2B” at a-s Elbau, funded by Teknologistyrelsen.

1986: Elbau and Radiometer Electronic Theme day at Hotel Eremitage (Denmark). Title: Undersøgelse af Polymer TykFilm teknologiens muligheder og begrænsninger.

1986: EKF-seminar at Hotel Holmenkollen (Norway). Title: Results from the joint Nordic project, PC2B .

1985: Elektronik seminar 85, at Bellacenteret (Denmark). Theme: Production techniques in the Electronic Industry. Title: Polymer Circuit and Component Board (PC2B).