June 2017: Asymtek Technology Days, Geldrop, The Netherlands: Title: Coating considerations.
June 2015: Asymtek Technology Days, Maastricht, The Netherlands: Title: Why and When is Coat and Underfill needed?
Apr 2015: HIN Seminar, Horsens, Denmark: Why and when is Coating and Cleaning needed?
Oct 2014: Article in the Danish Electronics News Magazine “Elektronik & Data” October edition: "Coating beskytter elektronikken".
Aug 2014: Article in the Danish Electronics News Magazine “Elektronik & Data” August edition: "Dybt i Nokias maskinrum".
2014: PCB Reliability Seminar, Copenhagen, Denmark: How to improve PCB/PCBA design, performance and reliability.
Mar 2013: SPM Erfagruppe 20 – DFMA – Design For Manufacturing and Assembly meeting hosted by B&O, Struer, Denmark: From DIL-packages to Embedded Components V2.0. The evolution of Component Packaging-, Interconnection- and Substrate-Technologies.
Nov 2012: IPU “Corrosion in Electronics” Seminar, Lyngby, Denmark. Title of presentation: Organisation structure impact on reliability problem solving.
Dec 2011: Printline Seminar at the Danish Embassy in Oslo Norway.Title of presentation 1: From DIL-Packages to Embedded Components. Title of presentation 2: Interconnect reliability problems and solutions.
Nov 2011: Printline Seminar, Odense Denmark. Title of presentation 1: From DIL-Packages to Embedded Components. Title of presentation 2: Interconnect reliability problems and solutions.
Jun 2011: Asymtek Technology Days, Heerlen The Netherlands: Title: Micro Coating and Underfill – a must to obtain high reliability of mobile devices.
Mar 2003: DAMAG Temadag for printdesignere, Odense Denmark: Title: Kultryk på print.
Apr 2006: ICEP Conference, Tokyo Japan: Title: Paradigm shift for PWB surface finishes in mobile phone terminals.
Feb 2006: Pan Pacific Electronic Symposium, Hawaii, Title: New trends for PWB surface finishes in mobile phone applications.
2004: IMAPS Nordic Conference, Helsingør Denmark: Title: The evolution of surface finishes in mobile phone applications.
1993: Articles in the Danish Electronics News Magazine “Elektronik & Data”: June edition: Laser trimming Thickfilm Hybrids. October edition: “Chip & Wire” techniques
1991: Article in the international magazine “Circuit World” Vol.17, Number 3: Design Guidelines for Polymer Thickfilm Technology.
1990: Co-author to: Polymer Thickfilm Technology design guidelines and applications. A result of a Nordic cooperation project (1988-1990) supported by Nordic Fund for Technology and Industrial Development (Nordisk Industrifond). ISBN 82-992193-0-2.
1990: Theme days at “Instituttet for Verkstadsteknisk Forskning” (Sweden), and at Elektronik Centralen (Denmark), Title: Polymer Thick Film Connection Techniques.
1990: ISHM NORDIC Conference at Ålandsøerne (Finland). Title: PTF. An attractive supplement to traditional Thickfilm and PCB technology.
1987: Polymer Circuit and Component Board (PC2B). EC-report ECR-202.
1986: ISHM NORDIC Conference in Helsinki, Finland. Title: Results from the PTF Research Project “PC2B” at a-s Elbau, funded by Teknologistyrelsen.
1986: Elbau and Radiometer Electronic Theme day at Hotel Eremitage (Denmark). Title: Undersøgelse af Polymer TykFilm teknologiens muligheder og begrænsninger.
1986: EKF-seminar at Hotel Holmenkollen (Norway). Title: Results from the joint Nordic project, PC2B .
1985: Elektronik seminar 85, at Bellacenteret (Denmark). Theme: Production techniques in the Electronic Industry. Title: Polymer Circuit and Component Board (PC2B).